In the pattern plating-etching process, there may be three cases in which the total thickness of the tin-lead metal layer or other metal layers is inconsistent with the thickness of the resist layer after copper plating:

 

The total thickness of the plating layer is less than the thickness of the resist layer, and the plating layer is not widened.

 

The total thickness of the electroplated copper layer is smaller than the thickness of the resist layer, and when the sum of the thickness of the electroplated tin-lead alloy layer and the thickness of the electroplated copper layer is larger than the thickness of the resist layer, only the width of the tin-lead alloy is widened.

 

The thickness of the electroplated copper exceeds the thickness of the anti-etching layer, and at this time, not only the line width of the electroplated copper layer is widened but also the subsequent tin-lead alloy layer or other metal plating layer is further w